SMIC produced 5nm chips without EUV, using older DUV tech and advanced patterning. This bypasses U.S. export bans, potentially powering Huawei’s Kirin 9000S. A key step in China’s chip self-sufficiency.
In a development that could disrupt the semiconductor landscape, China’s Semiconductor Manufacturing International Corporation (SMIC) has reportedly succeeded in producing 5nm chips without relying on extreme ultraviolet (EUV) lithography—a technology long considered essential for cutting-edge chipmaking.
BREAKING: China made 5nm chips without EUV.
— William Huo (@wmhuo168) April 23, 2025
Let that sink in.
No ASML.
No Nikon.
Just brute-force DUV, clever engineering, and sheer industrial will.
Moore’s Law didn’t die.
It moved to Shanghai.
By leveraging older deep ultraviolet (DUV) equipment combined with an intricate technique called Self-Aligned Quadruple Patterning (SAQP), SMIC has managed to circumvent Western export restrictions that blocked access to advanced EUV machines. The achievement, highlighted by semiconductor analyst William Huo on X, carries both technological and geopolitical significance.
Industry experts had previously assumed that EUV lithography—exclusively produced by Dutch firm ASML—was indispensable for manufacturing chips at 5nm and beyond. With U.S.-led sanctions preventing China from acquiring these tools, many believed Chinese chipmakers would be stuck at the 7nm node.
However, SMIC overcame these limitations by refining DUV-based methods, using multiple patterning steps to achieve EUV-level precision. While this approach is more time-consuming, costly, and prone to defects, it has reportedly yielded functional 5nm-class processors—possibly powering Huawei’s Kirin 9000S chip in devices like the Mate 60, which made headlines for surpassing the iPhone 15 with satellite calling capabilities.
This milestone not only demonstrates China’s determination to advance its semiconductor independence but also challenges the global industry’s reliance on EUV technology.